发明名称 METHOD OF MANUFACTURING THERMALLY EXPANDABLE MICROCAPSULE
摘要 PROBLEM TO BE SOLVED: To provide an efficient and simple method of manufacturing a thermally expandable microcapsule which has excellent heat resistance and solvent resistance in combination, hardly gives rise to shrinking and foam breaking even under heating conditions of a high temperature and long time and has excellent thermal inflation stability (foaming stability). SOLUTION: The method of manufacturing the thermally expandable microcapsule comprising microcapsulating a monomer component containing 55 to 75 wt.% acrylonitrile, 20 to 40 wt.% methacrylonitrile, 1 to 10 wt.% vinyl acetate, and 0.1 to 1 wt.% tetra- or higher functional crosslinking agent and a volatile inflating agent which turns to a gaseous state at a temperature below the softening point of the polymer obtained from the monomer component described above by polymerization under nitrogen pressurization.
申请公布号 JP2003001099(A) 申请公布日期 2003.01.07
申请号 JP20010188239 申请日期 2001.06.21
申请人 SEKISUI CHEM CO LTD;TOKUYAMA SEKISUI IND CORP 发明人 KAWAGUCHI YASUHIRO;OMURA TAKAHIRO;FURUKAWA TOSHIHARU
分类号 B01J13/14;(IPC1-7):B01J13/14 主分类号 B01J13/14
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