发明名称 |
METHOD OF MANUFACTURING THERMALLY EXPANDABLE MICROCAPSULE |
摘要 |
PROBLEM TO BE SOLVED: To provide an efficient and simple method of manufacturing a thermally expandable microcapsule which has excellent heat resistance and solvent resistance in combination, hardly gives rise to shrinking and foam breaking even under heating conditions of a high temperature and long time and has excellent thermal inflation stability (foaming stability). SOLUTION: The method of manufacturing the thermally expandable microcapsule comprising microcapsulating a monomer component containing 55 to 75 wt.% acrylonitrile, 20 to 40 wt.% methacrylonitrile, 1 to 10 wt.% vinyl acetate, and 0.1 to 1 wt.% tetra- or higher functional crosslinking agent and a volatile inflating agent which turns to a gaseous state at a temperature below the softening point of the polymer obtained from the monomer component described above by polymerization under nitrogen pressurization. |
申请公布号 |
JP2003001099(A) |
申请公布日期 |
2003.01.07 |
申请号 |
JP20010188239 |
申请日期 |
2001.06.21 |
申请人 |
SEKISUI CHEM CO LTD;TOKUYAMA SEKISUI IND CORP |
发明人 |
KAWAGUCHI YASUHIRO;OMURA TAKAHIRO;FURUKAWA TOSHIHARU |
分类号 |
B01J13/14;(IPC1-7):B01J13/14 |
主分类号 |
B01J13/14 |
代理机构 |
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主权项 |
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地址 |
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