EPOXY RESIN COMPOSITION

摘要

PROBLEM TO BE SOLVED: To provide an epoxy resin composition used for sealing a semiconductor device. SOLUTION: This epoxy resin composition contains (A) an epoxy resin expressed by general formula (I) (wherein, R1 to R8 may be the same or different and are each an atom or group selected from a group consisting of H and alkyl groups), (B) a phenol resin and (C) a mixture of aluminum oxide (alumina) and silica filler constituting 80-92 wt.% based on the epoxy resin composition and having at least 10.5 ratio of the filler content (weight) to the total weight of the (A) epoxy resin and (B) phenol resin and (D) 0.1-0.4 wt.% curing accelerator based on the epoxy resin composition.