| 摘要 |
A CPU chip-cooling device is provided. The CPU chip is disposed on a chassis, and the cooling device comprises a heat sink, a bracket and a fan. The heat sink is disposed on the CPU chip. The bracket, having a pivot portion and a retention portion, is pivotally disposed on the chassis by the pivot portion. The fan is disposed on the bracket. The fan is adjacent to the heat sink when the bracket engages with the chassis by the retention portion. The fan is away from the heat sink when the retention portion of the bracket does not engage with the chassis.
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