| 摘要 |
PROBLEM TO BE SOLVED: To provide an inexpensive soldering composition which does not contain lead, and moreover, is capable of fluidization by heating at a relatively low temperature at the time of soldering, is excellent in solder wettability, is hardly fluidized even in the vicinity of a heating temperature at the time of soldering at the other part after solidifying, is capable of obtaining a solder joining part with high strength, and particularly is suitably used for forming the inside connection of an electronic component, a soldering method, and an electronic component. SOLUTION: The soldering composition contains first metallic powder 2 comprising tin or a tin alloy and second metallic powder having a higher melting point than the first metallic powder 2 and comprising copper or a copper alloy. In the case that the total amount of all the metallic powders in the soldering composition is taken as 100 mass%, the content ratio of the first metallic powder 2 is larger than 60 mass% and not more than 85 mass%, and the content ratio of the second metallic powder 4 is 15 mass% or more and less than 40 mass%. COPYRIGHT: (C)2003,JPO |
