| 摘要 |
PROBLEM TO BE SOLVED: To nondestructively and appreciably efficiently inspect a setting level (or reaction rate) of a set matter of a setting adhesive in a connection region between an electronic part and a wiring board in an electronic device in which the electronic part is mounted on the wiring board. SOLUTION: A method for nondestructively inspecting a setting level of a set matter of a setting adhesive composition comprises mixing a fluorescent component adapted to fluoresce when irradiated with exciting light into a setting adhesive composition, setting the setting adhesive composition including the fluorescent component, irradiating the obtained set matter with exciting light, and observing resultant fluorescence to inspect a setting level of the set matter. COPYRIGHT: (C)2003,JPO
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