发明名称 PACKAGE FOR HOUSING SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To normally and stably operate a semiconductor element to be housed by preventing a crack from occurring at an insulator of a coaxial connector for a long period and to satisfactorily transmit a high-frequency signal. SOLUTION: The package for housing the semiconductor element comprises: a base 1 having a placing part 1a of the element 5 on an upper main surface; a frame 2 made of a metal having a small diameter part, an intermediate diameter part 11 and a large diameter part 1c and a through hole 2b to surround the part 1a on the main surface of the base 1; and a coaxial connector 3 having a cylindrical outer peripheral conductor 3a inserted and brazed from the outside of the frame 2 to the part 11, a central conductor 3b installed at a central axis of the conductor 3a and an insulator 3c interposed between the conductor 3a and the conductor 3b. In this package, a step is formed on the overall periphery between the part 11 and the part 2c of the hole 2b, and an annular metal member 12 disposed in the part 2c at the other end and adhered at one end to the step is provided. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003273262(A) 申请公布日期 2003.09.26
申请号 JP20020070157 申请日期 2002.03.14
申请人 KYOCERA CORP 发明人 KIHARA TAKAHIRO
分类号 H01L23/04;(IPC1-7):H01L23/04 主分类号 H01L23/04
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