| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly reliable package for containing an electronic component in which airtight sealing can be carried out efficiently with a lower welding current level and cracking does not take place in the insulating basic body. SOLUTION: The package for containing an electronic component comprises the insulating basic body 1 having a part 1a for mounting an electronic component 3 on the upper surface thereof and a sealing metallization layer 6 applied to surround the mounting part 1a, and a metal cover 2 having a lower surface applied with a solder material 8 and being bonded to the sealing metallization layer 6 through the solder material 8 by seam welding wherein the sealing metallization layer 6 has a thickness of 4-8μm and a nickel plating layer having a thickness of 8-20μm is applied to the surface thereof. COPYRIGHT: (C)2004,JPO |
