| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for heat radiating an FET with a heat sink plate, which can suppress the temperature rise of the FET with an extremely simple constitution. SOLUTION: The method for heat radiating the FET 2 with the heat sink plate comprises the steps of: mounting a conductive foil 12 on a printed circuit board 1 on the surface of an insulating base material 11; previously providing a plated through hole 13 at the FET mounting position of the board 1; and soldering the heat sink plate 22 of the FET 2 with the heat sink plate so as to fill the solder 14 in the hole 13. COPYRIGHT: (C)2004,JPO |
