MULTILAYER WIRING BOARD, BASE MATERIAL FOR THE SAME AND THEIR MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a base material for a multilayer wiring board by which a thin multilayer wiring board can be obtained without failing connection reliability between a conductive resin composition and a conductive circuit and lowering the flatness of the board. SOLUTION: The diameter of a conductive layer 14b of a through hole 14 is made smaller than those of an insulation layer and an adhesion layer part 14a, and conductive connection between a conductive resin composition 15 and a conductive layer 12 is ensured on the rear surface 12a of the conductive layer 12, and then the conductive layer 14b is also filled with the conductive resin composition 15 in addition to the insulation layer and the adhesion layer part 14a. COPYRIGHT: (C)2004,JPO