| 摘要 |
PROBLEM TO BE SOLVED: To solve a problem that a solder between the thermoelectric element and the metallic member of a thermoelectric element module is cracked due to concentration of thermal stress to cause deterioration in the performance of the thermoelectric element module and a semiconductor module comprising it. SOLUTION: In the thermoelectric element module 10, the opposite ends of a plurality of thermoelectric elements 1 are bonded between a pair of insulator substrates 2 through respective metallic members 5, and a semiconductor element is mounted on one insulator substrate 2. The metallic member 5 abuts against the end face of the thermoelectric element 1 on the bottom face of a first recess 5a, and a part for collecting solder 3 is formed between the inner side face of the first recess 5a and the outer side face at the end of the thermoelectric element 1 facing it. Furthermore, the end face on the side opposite to the first recess 5a abuts against the bottom face of a second recess 2a formed in the insulator substrate 2, and a part for collecting solder 4 is formed between the inner side face of the second recess 2a and the outer side face at the end part of the metallic member 5 facing it. COPYRIGHT: (C)2004,JPO |
