APPARATUS AND METHOD OF SIMULTANEOUSLY MOLDING MULTIPLE SEMICONDUCTOR ELEMENTS

摘要

PROBLEM TO BE SOLVED: To provide a molding apparatus for simultaneously molding multiple semiconductor elements. SOLUTION: The molding apparatus comprises a metal mold (200) prepared to mold multiple semiconductor elements, multiple plungers (110) which are plunged into the mold and operated to inject a molding material which encapsulates the semiconductor elements in the mold, and a plunger block which operates the plungers at the same time. Load sensors and contact sensors are installed under the respective plungers to individually detect abnormalities of the plungers. COPYRIGHT: (C)2004,JPO