| 摘要 |
PROBLEM TO BE SOLVED: To prevent the generation of a blur on the surface of a substrate caused by an adhesive agent regarding treatment equipment which contains back-side etching equipment wherein the back of the substrate is etched in constituent, and regarding an adhesive agent eliminating method. SOLUTION: In the treatment equipment which is provided with a grinder 10 for performing the back-grinding treatment of a wafer 2 which is stuck on a protective tape 3 with an adhesive agent 8, and the back-side etching equipment 20 wherein the back of the wafer 2 which is ground by the grinder 10 is subjected to back-side etching, UV irradiation equipment 50A for curing the adhesive agent 8 exposed from the protective tape 3 is installed. As a result, the adhesive agent 8 is prevented from generating an evaporation component like a monomer/polymer, so that the generation of a blur on the wafer 2 (semiconductor element 60) is prevented. COPYRIGHT: (C)2004,JPO |
