| 摘要 |
PURPOSE: An apparatus for manufacturing a semiconductor device is provided to be capable of preventing a wafer from being contaminated due to the exposure to the outside and reducing loss time by using a vacuum state connecting path. CONSTITUTION: An apparatus for manufacturing a semiconductor device is provided with a process chamber A(30) for carrying out the first semiconductor device manufacturing process, a vacuum pump A(32) connected with the process chamber A for controlling the inner pressure of the process chamber A, a process chamber B(40) for carrying out the second semiconductor device manufacturing process, and a vacuum pump B(42) connected with the process chamber B for controlling the inner pressure of the process chamber B. The apparatus for manufacturing the semiconductor device further includes a connecting path(50) for connecting the process chamber A with the process chamber B, a vacuum pump C(52) connected with the connecting path for controlling the inner pressure of the connecting path, and a wafer transfer robot arm(4) installed at the connecting path. At this time, a blocking part is located at each end portion of the connecting path for switching the connecting path.
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