| 发明名称 |
Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus |
| 摘要 |
A polishing pad for a chemical mechanical polishing apparatus. The polishing pad includes a plurality of concentric circular grooves. The polishing pad may include multiple regions with grooves of different widths and spacings.
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| 申请公布号 |
US6699115(B2) |
申请公布日期 |
2004.03.02 |
| 申请号 |
US20020330876 |
申请日期 |
2002.12.27 |
| 申请人 |
APPLIED MATERIALS INC. |
发明人 |
OSTERHELD THOMAS H;KO SEN-HOU |
| 分类号 |
B24B37/00;B24B37/04;B24D13/14;H01L21/304;(IPC1-7):B24D11/00 |
主分类号 |
B24B37/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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