Method of forming protection film for covering electronic component and electronic device having protection film

摘要

A method for forming a protection film capable of effectively sealing an organic EL device mounted on a surface of a substrate is provided, for example. Crucibles 15a to 15c as vapor sources are disposed facing the organic EL device 2 mounted on the surface of the transparent substrate 1. There is also provided a mask 11 having an opening 11a facing the organic EL device 2 and the mask 11 is disposed between the substrate 1 and a crucible 15. Distances of the mask 11 from the substrate are progressively increased and materials evaporated from the crucibles 15a to 15c are selected, to thereby form a first layer of protection film 21 for covering the EL device 2, a second layer of protection film 22 for covering beyond the first layer of protection film, and further third or more layers of protection films similarly.