| 摘要 |
<p>The purpose of the invention is to provide a double-sided adhesive tape which prevents a wafer from damaging even when the wafer has a considerably thin thickness of about 50 mum, which has improved handlability, which is favorably used for processing of an IC chip and which facilitates its peeling, and a method for manufacturing an IC chip using it. A double-sided adhesive tape containing a gas generating agent for generating a gas by stimulation in at least one side thereof.</p> |
