发明名称 Wiring boards
摘要 In a flexible wiring board of the present invention, a first shield film is connected to a ground wiring at the bottom of an opening in a cover film. The first shield film is connected to a second shield film via a through-hole penetrating from the surface to the rear surface of a base film. Thus, the second shield film is connected to the ground wiring via the first shield film, whereby the wiring board can be wholly shielded.
申请公布号 US6777622(B2) 申请公布日期 2004.08.17
申请号 US20030351725 申请日期 2003.01.27
申请人 SONY CHEMICALS, CORP. 发明人 UENO YOSHIFUMI;TAKIKAWA YOKIHIRO
分类号 H05K9/00;H01B7/08;H01B7/17;H05K1/00;H05K1/02;(IPC1-7):H05K7/06 主分类号 H05K9/00
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