| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a capacitor-incorporated substrate and a chip type capacitor which improve the strength and flatness of a laminated body by deterring shrinkage in surface direction. <P>SOLUTION: The laminated body 1 is formed by alternately laminating 1st dielectric layers 1a to 1f and 2nd dielectric layers 1g to 1l formed by burning two kinds of compositionally different inorganic constituents. 1st electrode layers 2a and 2nd electrode layers 2b are alternately interposed between the 1st dielectric layers and 2nd dielectric layers which are adjacent along the thickness of the laminated body 1 while partially facing each other, and also electrically connected to a conductor layer 4 bonded to the external surface of the laminated body 1. Further, the 2nd dielectric layers 1g to 1l are thicker than the 1st dielectric layers 1a to 1f and burnt at a temperature higher than that for the 1st dielectric layers. <P>COPYRIGHT: (C)2004,JPO&NCIPI</p> |
