| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device having a laminated layer CSP, which is capable of testing for every semiconductor chip at a low cost and has no restriction in a chip size. <P>SOLUTION: The whole surface of the bottom of a semiconductor chip 1 is bonded to a first insulating film 4, and a second insulating film 5 is bonded to the whole surface of the upper surface of the semiconductor chip 1 and the first insulating film 4. A first hole 8 penetrating the second insulating film 5 to expose the upper surface of the semiconductor chip 1 and second holes 9, 10 penetrating the first insulating film 4 and the second insulating film 5 are formed. A first conductor 11 is buried into the first hole 8, and second conductors 12, 13 are buried into the second holes 9, 10. A first wiring 15 electrically connecting the second conductors 12, 13 is formed on the surface of the first insulating film 4, and a second wiring 14 electrically connecting the first conductor 11 and the second conductors 12, 13 are formed on the surface of the second insulating film 5. <P>COPYRIGHT: (C)2004,JPO&NCIPI</p> |
