The present invention provides materials and methods for improving the DC and RF performance of off-state step-stressed high electron mobility transistors (HEMTs) and devices. A semiconductor device can include at least one HEMT and an on-chip heating source. A method of recovering the DC and RF performance of a stressed semiconductor device can include annealing the device with a built-in heating source of the device.
申请公布号
WO2016160564(A1)
申请公布日期
2016.10.06
申请号
WO2016US24197
申请日期
2016.03.25
申请人
UNIVERSITY OF FLORIDA RESEARCH FOUNDATION INCORPORATED