SEMICONDUCTOR DEVICE FOR REDUCING THE NUMBER OF PROBING PAD USED DURING WAFER TEST AND TEST METHOD THEREOF, ESPECIALLY INCLUDING SELECTION CIRCUIT TRANSMITTING TEST SIGNAL FROM THE PROBING PAD TO ONE OF PLURAL INNER CIRCUIT

摘要

PURPOSE: A semiconductor device for reducing the number of probing pad used during the wafer test and a test method thereof are provided to reduce test time by having select circuit transferring a select signal input from a probing pad to one of plural inner circuit according to a test mode signal. CONSTITUTION: A semiconductor device for reducing the number of probing pad used during the wafer test comprises plural inner circuit blocks including plural inner circuits(12A-12N) on the wafer(10); a select circuit part(14) for selectively transferring a test signal from each probing pad corresponding to the inner circuit blocks to one of inner circuits among the corresponding inner circuit blocks according to a test mode signal(TMS0-TMSm) generated during the wafer test; a probe card(20); a test system(30). And a test method for the semiconductor device comprises the steps of: dividing the plural inner circuits on the wafer into plural inner circuit blocks; selectively transferring a test signal from each probing pad corresponding to each block to one of inner circuits among the corresponding inner circuit blocks according to a test mode signal generated during the wafer test; monitoring and testing the action of the inner circuit to the transferred test mode signal through the probing pad.