| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a new resist composition for manufacture of a printed board. <P>SOLUTION: The new resist composition contains: (A) a resin component; (B) a photopolymerization initiator; (C) water; and (D) an organic solvent. The organic solvent (D) contains: (D-1) at least one kind of organic solvent selected from the group consiting of α-hydrocarboxylate, β-alkoxycarboxylate, 1,3-diol compounds and 1,3-diol compound derivatives; and (D-2) an organic solvent having a hydroxyl group excluding the above (D-1). The resist composition suppresses a problem of ion crosslink by copper ions eluting from a copper plate in a dip coating method while keeping sensitivity. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
