| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device in which a semiconductor device element is electrically connected to the outside with electrodes for external connection and which can be miniaturized, and to provide a method of manufacturing the same. <P>SOLUTION: The semiconductor device 1 comprises a wiring substrate 10 in which through-holes 18a are formed piercing from a surface 10A to the backside surface 10B, electrodes for external connection formed on the inner wall faces of the through-holes 18a, a blocking film 22a against the electrodes 20a for external connection, arranged on the surface side of the wiring substrate and composed of a dry film, a protecting film 24a formed on the blocking film by curing a photosensitive liquid resin, a semiconductor device element 12 mounted on the surface of the wiring substrate and electrically connected to the electrodes for external connection, and a sealing resin 28 for sealing the semiconductor device element. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
