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发明名称
雷射加工装置
摘要
于雷射加工装置当中,乃具备,将雷射振荡器1所射出的雷射光引导至被加工物(20)的多数的光学元件所组成的光学系统,并以第一偏光分离机构(5)将一条雷射光分光为两条雷射光,一条经由反射镜(14),另一条由第一检流扫描镜(Galvano Scan Mirror)(13)向2轴方向扫描,于引导两条雷射光至第二偏光分离机构(8)之后,由第二检流扫描镜(12)进行扫描,而加工被加工物(20)。此雷射加工装置特征为,以对雷射光的光轴呈45°的方式来配置上述第一及第二偏光分离机构。
申请公布号
TW200539981
申请公布日期
2005.12.16
申请号
TW093126144
申请日期
2004.08.31
申请人
三菱电机股份有限公司
发明人
京藤友博;黑岩忠;小林信高
分类号
B23K26/067
主分类号
B23K26/067
代理机构
代理人
洪武雄;陈昭诚
主权项
地址
日本
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