| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To stably support the heatsink of a semiconductor laser device when wire bonding is performed. <P>SOLUTION: The semiconductor laser device is provided with a semiconductor laser element and the metallic heatsink 4 having an arcuate curved surface in its outer periphery and, at the same time, a groove 5 formed in the same direction as the optical axis of the semiconductor laser element. The groove 5 has a flat surface used for arranging the semiconductor laser element, and the heatsink 4 has a flat surface 22 which is formed in parallel with the flat surface used for arranging the laser element on its bottom face. The bottom face 22 of the heatsink 4 has a larger area than the flat surface used for arranging the laser element has. Since the heatsink 4 has the large flat surface on its bottom face 22 while the heatsink 4 has the unstable arcuate curved surface in its periphery, the heatsink 4 can be held stably when wiring bonding is performed. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
