MULTI-CHIP INTEGRATED CIRCUIT CARRIER

摘要

PROBLEM TO BE SOLVED: To prevent complex thermal stresses from occurring in a multi-chip integrated circuit carrier.

SOLUTION: An integrated circuit carrier includes a plurality of receiving zones. Each receiving zone includes electrical contacts and is configured to receive a particular type of integrated circuit. A plurality of island-defining portions are arranged centering around each receiving zone. Each island-defining portion has an electrical terminal electrically connected to one electrical contact of its associated receiving zone.

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