| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor package with laminated semiconductor chips, capable of preventing bonding defects or the like without lowering the degree of freedom of the arrangement of an electrode pad. <P>SOLUTION: The semiconductor package comprises: a package substrate 10 provided with a plurality of connection terminals 11 on the surface; the semiconductor chip 100 provided with a plurality of bonding pads 101 on the surface; a plurality of bonding wires 102h and 102l for respectively connecting the plurality of connection terminals 11 and the plurality of bonding pads 101; a resin 103 formed so as to fill a gap between the bonding wires 102h and 102l and the surface of the semiconductor chip 100; and the semiconductor chip 200 provided on the bonding wires 102h and 102l through a film-like resin 203. At least three bonding wires 102h of the plurality of bonding wires 102h and 102l are formed at the almost same height and to be higher than the other bonding wires 102l. <P>COPYRIGHT: (C)2008,JPO&INPIT |
