| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve manufacturing quality in mounting process. <P>SOLUTION: According to this system (surface mounter Z3, solder printer Z2 and mounting line L), information (information about substrate inspection before printing) about inspection of a substrate P which has been executed before printing is utilized in a printing process and a mounting process. In this way, printing failure and a mounting failure of components can be reduced and the manufacturing quality can be improved in the mounting process. <P>COPYRIGHT: (C)2008,JPO&INPIT |
