| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a multilayer wiring board that is not only compact but also thin as well as low cost. <P>SOLUTION: An interlayer connection portion 23 is preferably formed to be connected between, for example, a first conductive portion 21a formed on a first insulating portion 11a and a first conductive portion 21b formed on a different first insulating portion 11b disposed superposingly with the first insulating portion 11a. The multilayer printed wiring board 10 having such structure as disclosed above results in forming a plurality of function elements such as a resistor and the like between a plurality of first laminated insulating portions 11 by forming the interlayer connection portion 23 between the first insulating portions 11a and the first insulating portions 11b. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
