| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a positive photosensitive heat-resistant resin composition which can be cured at low temperature, has high sensitivity and ensures excellent heat resistance of a cured product. <P>SOLUTION: The positive photosensitive resin composition includes (a) 100 pts.wt. of a novolac resin, (b) 20-70 pts.wt. of a resin consisting mainly of a structural unit represented by formula (1), (c) 0.5-20 pts.wt. of a compound having a phenolic hydroxyl group, and (d) 1-60 pts.wt. of a quinonediazide compound, wherein R<SP>1</SP>denotes a tri- to tetravalent organic group having at least 2C, and R<SP>2</SP>denotes a divalent organic group having at least 2C, provided that both R<SP>1</SP>and R<SP>2</SP>do not have a hydroxyl group bonding to α-carbon of carbon bonding to CONH group; R<SP>3</SP>denotes hydrogen or a 1-20C hydrocarbon group, provided that ≥50 mol% of R<SP>3</SP>'s are 1-20C hydrocarbon groups; and m denotes 1 or 2. <P>COPYRIGHT: (C)2009,JPO&INPIT |
