| 摘要 |
FIELD: electronics.SUBSTANCE: invention relates to components of electronic devices, namely, to methods and devices for assembly of packages for mobile devices. Package assembly includes an application specific integrated circuit (ASIC) and a micro-electromechanical system (MEMS) having an active and an inactive sides; the MEMS is connected directly with the ASIC through one or more inter-element connectors, MEMS, ASIC and one or more inter-element connectors form a cavity, such that the MEMS active section is within the cavity, the second MEMS and the second one or more inter-element connectors, herewith the second MEMS is connected directly with the ASIC through the second one or more inter-element connectors, herewith the second MEMS, the ASIC and the second one or more inter-element connectors form the second cavity between the second MEMS, the ASIC and the second one or more inter-element connectors, and the inter-element connection of the first one or more connections is connected to the redistribution level (RDL) of the ASIC.EFFECT: invention ensures reduction of dimensions and reduction of costs and production time.20 cl, 11 dwg, 25 ex |
