| 发明名称 | Polishing apparatus and polishing method | ||
| 摘要 | A polishing apparatus polishes a periphery of a substrate. This polishing apparatus includes a rotary holding mechanism configured to hold the substrate horizontally and rotate the substrate, plural polishing head assemblies provided around the substrate, plural tape supplying and recovering mechanisms configured to supply polishing tapes to the plural polishing head assemblies and recover the polishing tapes from the plural polishing head assemblies, and plural moving mechanisms configured to move the plural polishing head assemblies in radial directions of the substrate held by the rotary holding mechanism. The tape supplying and recovering mechanisms are located outwardly of the plural polishing head assemblies in the radial directions of the substrate, and the tape supplying and recovering mechanisms are fixed in position. | ||
| 申请公布号 | US9517544(B2) | 申请公布日期 | 2016.12.13 |
| 申请号 | US201414577101 | 申请日期 | 2014.12.19 |
| 申请人 | EBARA CORPORATION | 发明人 | Takahashi Tamami;Seki Masaya;Kusa Hiroaki;Yamaguchi Kenji;Nakanishi Masayuki |
| 分类号 | B24B21/00;B24B9/06;B24B37/04;B24B37/30;B24B21/20;B24B27/00;B24B41/06;B24B49/00 | 主分类号 | B24B21/00 |
| 代理机构 | Wenderoth, Lind & Ponack, L.L.P. | 代理人 | Wenderoth, Lind & Ponack, L.L.P. |
| 主权项 | 1. A polishing method comprising: rotating a substrate by a rotary holding mechanism; polishing a first region in a periphery of the substrate by pressing a polishing tape against the first region; polishing a second region in the periphery of the substrate by pressing the polishing tape against the second region; during said polishing of the second region, cleaning the first region by pressing a cleaning cloth against the first region; and after said polishing of the second region, cleaning the second region by pressing the cleaning cloth against the second region. | ||
| 地址 | Tokyo JP | ||