发明名称 |
Package method of substrate and package structure |
摘要 |
The present invention provides a package method of a substrate and a package structure. The method comprises: step 1, providing the substrate (1) and a package plate (3), and the package plate (3) comprises a spreading surface (31); step 2, forming at least one groove (311); step 3, spreading seal glue (50) to form the continuous frame (5), and a recess (51) is formed in the frame (5) corresponding to the groove (311); step 4, positioning underfill (70) inside an area surrounded by the frame (5); step 5, oppositely fitting the substrate (1) and the package plate (3), and an air outlet (20) is formed at a position of the recess (51) of the frame (5) between the substrate (1) and the package plate (3); step 6, extracting air between the substrate (1) and the package plate (3) through the air outlet (20); step 7, laminating the substrate (1) and the package plate (3); step 8, irradiating and solidifying the seal glue (50) and the underfill (70) with UV light. |
申请公布号 |
US9472603(B2) |
申请公布日期 |
2016.10.18 |
申请号 |
US201414381986 |
申请日期 |
2014.07.14 |
申请人 |
Shenzhen China Star Optoelectronics Technology Co., Ltd |
发明人 |
Chen Lindou;Shi Kai |
分类号 |
H01L21/44;H01L27/32;H01L21/56;H01L21/02;H01L23/31 |
主分类号 |
H01L21/44 |
代理机构 |
|
代理人 |
Cheng Andrew C. |
主权项 |
1. A package method of a substrate, comprising steps of:
step 1, providing the substrate and a package plate, and the package plate comprises a spreading surface; step 2, forming at least one groove in a spreading path of a frame on the spreading surface of the package plate; step 3, spreading a seal glue on the spreading surface of the package plate to form a continuous frame, and a recess is formed in the frame corresponding to the at least one groove; step 4, positioning an underfill inside an area surrounded by the frame on the spreading surface of the package plate; step 5, oppositely fitting the substrate and the package plate, and an air outlet is formed at a position of the recess of the frame between the substrate and the package plate; step 6, extracting air between the substrate and the package plate through the air outlet; step 7, laminating the substrate and the package plate; step 8, irradiating and solidifying the seal glue and the underfill with UV light to accomplish packaging the substrate with the package plate. |
地址 |
Shenzhen, Guangdong CN |