Semiconductor device and cooler thereof

摘要

A semiconductor device exhibits low pressure loss and is capable of cooling a plurality of power semiconductor chips evenly. This semiconductor device includes a semiconductor module and a cooler for cooling a power semiconductor element mounted in the semiconductor module. A cooling unit of the cooler has a first header part that has a first bottom surface disposed between a coolant inlet and an end portion of a first substrate on the coolant outlet side and inclined toward a bottom plane of cooling fins so that a coolant supplied from the coolant inlet flows toward the cooling fins; and a second header part that has a second bottom surface inclined from an end portion of the bottom plane of the cooling fins on the coolant outlet side so that the coolant discharged from the cooling fins flows to the coolant outlet.

主权项

1. A semiconductor device comprising:
a semiconductor module having a substrate and a power semiconductor elements; a heat dissipation base; cooling fins forming a cluster of at least one of a plurality of pin members or a plurality of blade members, the cluster having a rectangular cuboid contour and provided on a first principal surface of the heat dissipation base; a cooler fixed to the heat dissipation base and having a cooling unit accommodating the cooling fins therein and a coolant inlet and a coolant outlet formed at respective ends of the cooling unit to face each other in a longitudinal direction; a first substrate having at least a first one of the power semiconductor elements, the first substrate bonded to a second principal surface of the heat dissipation base at a coolant inlet side such that a position of the first substrate corresponds to a position of the cooling fins; and a second substrate having at least a second one of the power semiconductor elements, the second substrate bonded to the second principal surface of the heat dissipation base at a coolant outlet side, wherein the cooling unit includes:
a first header part having at least a first bottom surface that is inclined toward a bottom plane of the cooling fins so that a coolant supplied from the coolant inlet flows from a side plane of the cooling fins and the bottom plane of the cooling fins on the coolant inlet side into the cooling fins and toward the coolant outlet;a second header part having at least a second bottom surface that is inclined from an end portion of the bottom plane of the cooling fins so that the coolant discharged from the cooling fins flows to the coolant outlet, anda third bottom surface extending between the first bottom surface and the second bottom surface and parallel to the bottom plane of the cooling fins,wherein an inclination angle of the first bottom surface with respect to the bottom plane of the cooling fins is smaller than an inclination angle of the second bottom surface with respect to the bottom plane of the cooling fins, andwherein a top portion in which the first bottom surface and the third bottom surface intersect, is located between a lower part of a center of the first substrate and a lower part of an end portion of the first substrate on the coolant outlet side.