发明名称 Circuit board
摘要 This wiring board is provided with: a plurality of metal wires disposed upon an insulating substrate; and a transparent adhesive agent layer which is disposed upon the metal wires, and which is in direct contact with the metal wires. The metal wires include: a first metal wire which has a pulse signal supplied thereto; and a second metal wire which has a fixed electric potential applied thereto. The pulse signal has a reference level identical to the fixed electric potential, and has a pulse train in which a plurality of pulses having a pulse width of not more than 3 msec are arranged, the integral time of the pulses in a period of 600 seconds being less than 60 seconds.
申请公布号 US9491858(B2) 申请公布日期 2016.11.08
申请号 US201514864895 申请日期 2015.09.25
申请人 FUJIFILM Corporation 发明人 Endo Yasushi;Tada Nobuyuki;Naoi Kenji;Asai Tomohito;Ikeda Hideo;Shibata Michihiro
分类号 H05K1/09;H05K1/11;C09J133/26;C08F220/18;C09J133/08;C09J133/10;H05K1/02;H05K3/28;G06F3/044;H05K3/46 主分类号 H05K1/09
代理机构 Jianq Chyun IP Office 代理人 Jianq Chyun IP Office
主权项 1. A circuit board having a plurality of metal interconnects disposed on an insulating base and a transparent adhesive layer disposed on the metal interconnects in direct contact with the metal interconnects, wherein the metal interconnects include: first metal interconnects to which a pulse signal is supplied; and second metal interconnects to which a fixed potential is applied; and the pulse signal has a pulse train of a plurality of pulses whose reference level is the same as the fixed potential and which have a pulse duration of 3 milliseconds or shorter, and an integrated time of the pulses during 600 seconds is less than 60 seconds.
地址 Tokyo JP
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