Ephemeral bonding

摘要

Compositions containing an adhesive material and a release additive are suitable for temporarily bonding two surfaces, such as a wafer active side and a substrate. These compositions are useful in the manufacture of electronic devices where a component, such as an active wafer, is temporarily bonded to a substrate, followed by further processing of the active wafer.

主权项

1. A structure comprising: a semiconductor wafer having a front side and a back side; a carrier substrate having an attachment surface; and a temporary bonding layer disposed between the front side of the semiconductor wafer and the attachment surface of the carrier substrate; wherein the temporary bonding layer comprises a cured adhesive material and a polyether release additive, the release additive being free of silicon; wherein the temporary bonding layer is composed of a first region adjacent to the attachment surface of the carrier substrate having a relatively lower amount of release additive and a second region adjacent to the front side of the semiconductor wafer having a relatively greater amount of release additive.