| 发明名称 |
METHOD OF MOLDING THERMOSETTING RESIN CONTAINING FILLER |
| 摘要 |
PURPOSE:A filler is previously charged into the mold and then a thermoplastic resin is supplied, thus producing molded product containing a large amount of the filler simply without use of any extra device. |
| 申请公布号 |
JPS5421462(A) |
申请公布日期 |
1979.02.17 |
| 申请号 |
JP19770086877 |
申请日期 |
1977.07.20 |
| 申请人 |
HITACHI CABLE |
发明人 |
SATOU SEIKI;TOYAMA YASUHISA |
| 分类号 |
B29C39/24;B29B7/00;B29C39/00;B29C39/26;B29K101/10;B29K105/16 |
主分类号 |
B29C39/24 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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