ELECTRONIC CIRCUIT ELEMENT PACKAGE,申请号JP19790088389-传众专利搜索

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发明名称	ELECTRONIC CIRCUIT ELEMENT PACKAGE
摘要
申请公布号	JPS5530688(A)	申请公布日期	1980.03.04
申请号	JP19790088389	申请日期	1979.07.13
申请人	IBM	发明人	SE JIYUUN HONGU
分类号	G01R31/28;G01R31/02;G01R31/04;G01R31/3185	主分类号	G01R31/28
代理机构		代理人
主权项
地址

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