| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic device capable of connecting an electronic component with a high-density circuit pattern with accuracy.SOLUTION: A solution in which conductive nanoparticles whose grain diameter is less than 1 μm and an insulation material are dispersed, or a solution in which conductive nanoparticles coated with an insulation material layer are dispersed, is applied on a surface of a substrate that transmits light in a desired shape to form a film of the conductive nanoparticles coated with the insulation material. An electronic component is mounted on the film. The film is irradiated with light in a predetermined pattern from a rear face side of the substrate that transmits light, to sinter the conductive nanoparticles by the light. Thereby, a first circuit pattern connected with an electrode of the electronic component is formed, and the first circuit pattern and the electrode of the electronic component are fixed.SELECTED DRAWING: Figure 1 |
