| 摘要 |
PURPOSE:To automatically detect the snapping of a wire and prevent an IC element from being destroyed by empty bonding by optically detecting the existence of the wire being ultrasonically bonded. CONSTITUTION:A bonding tool 2 moves downwards to ultrasonically bond one end of a wire 1 to the bonding pad of an IC element 6, before moving upwards. Then the case 5 side or the tool 2 side performs a straight-line bonding on only one axis. In this apparatus, a lens 7 having an optical axis 10 is arranged in front of the tool 2. Then, from a lamp 8, light is applied to the wire 1 being drawn out in front of the tool 2 and oscillated by the ultrasonic wave in order to allow the lens 7 to project the magnified image of the wire 1 to an optoelectro transducer. This permits the existance of the wire 1 being bonded to be obtained as an electrical signal, and therefore the snapping of the wire can be automatically detected. |
