| 摘要 |
PURPOSE:A novel composition suitable for sealing up a device of a semiconductor, having improved humidity resistance, obtained by adding a silicone resin having an epoxy group-containing organic group, etc. and a hydroxyl group, etc., a curing agent, and an inorganic filler to an epoxy resin. CONSTITUTION:(A) An epoxy resin is blended with (B) a silicone resin (e.g., resins shown by the formulas I and II, etc.) having one or more epoxy or amino group-containing organic groups and one or more hydroxyl group or hydrolyzable groups, (C) a curing agent, e.g., a phenol compound, e.g., (D) an inorganic filler, e.g., molten silica powder, etc. to give the desired composition. Preferably, the amount of the ingredient B is 0.1-3wt%, the amount of ingredient C is an amount to give a ratio of number of epoxy group in ingredient A to number of functional group in ingredient C in a range 0.5-2, and the amount of ingredient D is an amount to give a weight ratio of A/C 100:33. EFFECT:Improved electrical properties and dimensional stability. |
