| 摘要 |
PURPOSE:To decrease the amount of expensive gold, etc. used, and to reduce cost by plating only a section necessary for the wire bonding of an inner lead. CONSTITUTION:When a bonding pad section of a chip 18 fitted on a tub 16 and the inner leads 14 are connected by wires 22, the lead frames except the sections to be plated of the inner leads 14 are masked, and plated. The wires are bonded to the sections 24 plated. Accordingly, since the expensive precious metals may not be plated up to an unnecessary position, the amount of the precious metals used decreases, and cost is reduced. |
