| 摘要 |
PURPOSE:To dispense with enlargement of the size of a package even when the number of leads is increased, by dividing a plurality of leads into the upper and lower ones and putting an insulating matter between them. CONSTITUTION:A lead frame is divided into two stages of the upper lead 5 and the lower lead 5, and glass 4 is put between them and bonded by heat treatment, while the lower lead 5' is made longer than the upper lead 5. A semiconductor chip 3 is fitted to an island part of the lead frame and a pad on the semiconductor chip 3 is connected selectively to the upper and lower leads 5 and 5' with fine metal wires and sealed with mold resin 1, whereby the package is formed. Bending of the leads is conducted later by a mold. By this method, enlargement of the package can be avoided even when the integration of the semiconductor chip is increased. |
