发明名称 |
Elevated edge-protected bonding pedestals for semiconductor devices |
摘要 |
An elevated bonding pad suitable for wire or lead frame attachment and having an insulating layer completely over its outer periphery. The structure simplifies the processing required to form an elevated bonding pad, and serves to protect the periphery against bonding damage, and provides protection against corrosion of the bonded encapsulated semiconductor unit.
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申请公布号 |
US4394678(A) |
申请公布日期 |
1983.07.19 |
申请号 |
US19790076879 |
申请日期 |
1979.09.19 |
申请人 |
MOTOROLA, INC. |
发明人 |
WINCHELL, II, VERN H.;SCHARR, THOMAS A.;CLARK, LOWELL E. |
分类号 |
H01L23/485;(IPC1-7):H01L23/48;H01L29/44;H01L29/52 |
主分类号 |
H01L23/485 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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