| 摘要 |
PURPOSE:To provided a package for a semiconductor device, which as excellent mechanical strength, good size stability and excellent environmental resistance by covering substantially all surface of the plastic package which is molded with resin with metal or metal compound. CONSTITUTION:A semiconductor pellet 1 is secured onto a lead frame, leads 2 of electrodes on a pellet 1 and of a lead frame are connected by bonding to wirings 3, and molded by heated at approx. 400 deg.C with plastic resin 4 of phenol series or the like. Subsequently, degreasing by trichloroethylene boiling and washing and a surface roughing by O2 plasma treatment are performed. Then, a jig which is also used as a masking on the part which is not necessary to cover is mounted, adhesiveness improving treatment is performed, and nickel is deposited, thereby forming an Ni film 10 of approx. 20mum. |
