| 摘要 |
A lapping method and apparatus providing accurate lapping of a workpiece surface and substantially even wear of the lap surface in the course of a lapping operation cycle. The workpiece having a surface to be lapped is held in an oscillating plate reciprocated along a first axis, and displaced at a much lower rate along a second axis. The plate is reciprocated along the first axis by means of a rigid link pivotally attached at one end to the plate and at another end to a rotating eccentric. The plate is displaced along the second axis by means of a pair of rigid parallel links pivotally attached to the plate at one end and pivotally attached each to a rotating eccentric at their other end.
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