| 摘要 |
PURPOSE:To provide the titled adhesive which exhibits excellent thermal strength even when cured after being left to stand for a long time, by mixing a resin mainly composed of a bismaleimide and a triazine resin monomer, an epoxy resin which is liquid at room temp. and an electrically conductive powder. CONSTITUTION:A component (A) composed of a bismaleimide of formula I (wherein Ar1 is a bivalent arom. group) and a triazine resin contg. a diisocyanate unit of formula II (wherein Ar2 is a bivalent arom. group) and triazine rings of formula III formed by the cyclopolymerization of at least three molecules of said diisocyanate in the molecular structure and having isocyanate groups at its terminal, an epoxy resin (B) which is liquid at room temp. such as bisphenol A epoxy resin, and an electrically conductive powder (C) such as silver powder are mixed together in such a proportion as to give a weight ratio of component A to component B of 10:90-90:10, thus obtaining the desired solventless electrically conductive adhesive. This adhesive is suitable for use in bonding IC chip to an insulated substrate, etc. |
