发明名称 Method for manufacturing display panel
摘要 A method for manufacturing a display panel, the display panel comprising an array substrate (1) and a color filter substrate which are cell assembled, liquid crystals filled between the array substrate (1) and the color filter substrate, which are adhered to each other by a sealant (2), the method comprising: coating the sealant (2) along peripheries of one side of one substrate among the array substrate (1) and the color filter substrate, the side being opposite to the other substrate; forming a light shielding layer (3) in an area encircled by the sealant (2) on a side of the array substrate (1) away from the color filter substrate; irradiating the array substrate provided with the light shielding layer (3) so as to cure the sealant (2); and removing the light shielding layer (3). The method provided by the embodiments of the present disclosure effectively avoids the phenomenon that liquid crystal molecules in an effective display area (4) are damaged by UV light during cell assembling.
申请公布号 US9488871(B2) 申请公布日期 2016.11.08
申请号 US201314378129 申请日期 2013.12.14
申请人 BOE Technology Group Co., Ltd. 发明人 Huang Hua
分类号 G02F1/1339;G02F1/1333;G02F1/1335 主分类号 G02F1/1339
代理机构 Collard & Roe, P.C. 代理人 Collard & Roe, P.C.
主权项 1. A method for manufacturing a display panel, the display panel comprising an array substrate and a color filter substrate adhered to each other by means of cell assembling, liquid crystals filled between the array substrate and the color filter substrate adhered to each other by a sealant, the method comprising: coating the sealant along peripheries of a side of one substrate of the array substrate and the color filter substrate, the side being opposite to the other substrate; forming a light shielding layer in an area encircled by the sealant on a side of the array substrate away from the color filter substrate, the light shielding layer attached to the array substrate in a manner of light shielding film wherein the light shielding layer is directly coated on the back side of the array substrate and wherein the light shielding layer is configured to shield the area encircled by the sealant from the light; irradiating the array substrate provided with the light shielding layer and curing the sealant; and removing the light shielding layer.
地址 Beijing CN