Microfluidic sensor package structure and method

摘要

In one embodiment, a microfluidic sensor device includes microfluidic sensor mounted on and electrically connected a micro lead frame substrate. The microfluidic sensor is molded to form a package body. The package body includes a molded panel portion and, in some embodiments, a mask portion having one or more open channels, sealed channels, and/or a sealed chamber exposing an active surface of the microfluidic sensor. The molded panel portions and mask portions are configured to allow a material to dynamically or statically contact the microfluidic sensor for analysis.

主权项

1. A microfluidic sensor device comprising:
a substrate comprising a chip-mounting plate and a plurality of leads spaced apart from and arranged in spaced relationship to the chip-mounting plate, wherein the chip-mounting plate and the plurality of leads comprise a conductive material, and wherein the chip-mounting plate has a chip-mounting plate top surface and a chip-mounting plate lower surface opposite to the chip-mounting top surface, and wherein each of the plurality of leads has a top lead surface and a lower lead surface opposite to the top lead surface; a microfluidic sensor having an active surface and a bonding surface opposite to the active surface, wherein the bonding surface is coupled to the chip-mounting plate top surface and electrically coupled to the leads; and a package body encapsulating at least portions of the substrate and the microfluidic chip, wherein the package body comprises a molded panel portion adjacent the active surface and defining a space that exposes at least portion of the active surface of the microfluidic sensor, and wherein the chip-mounting plate lower surface and the lower lead surface of each of the plurality of leads are exposed to the outside through a bottom surface of the package body.