发明名称 LED MODULE ALIGNMENT FOR PHOTOPRINT HEAD
摘要 PURPOSE:To obtain satisfactory printing quality and durability by forming a LED module with an array of LED's mounted and connected on a ceramic substrate and arranging plural pieces of LED module adhered on a ceramic base using an adhesive. CONSTITUTION:A LED array 8 is die-bonded on a ceramic substrate 10 with a conductor paste, and each dot of the LED array 8 is connected to each conductive pattern 10a on the ceramic substrate 10 at 1:1 using a wire bonding method. As a result, a LED module 13 is formed. A plurality of these LED modules 13 are arranged on a base 11 by printing width, and fitted and adhered on the surface of the base using an adhesive 14. In addition, LED arrays 8 are arranged in a straight line at an equal pitch. After adhering them, a focusing rod lens array 12 is arranged so that is may form an image on a photosensitive element at 1:1 by reflecting light from the LED array 8.
申请公布号 JPS61202859(A) 申请公布日期 1986.09.08
申请号 JP19850042780 申请日期 1985.03.06
申请人 OKI ELECTRIC IND CO LTD 发明人 NAKAMURA YUKIO;FURUYA HIROSHI;CHIBA OTOO
分类号 B41J2/44;B41J2/45;B41J2/455;H01L33/08;H01L33/58;H01L33/62 主分类号 B41J2/44
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